Direct Bridge with Synopsys OptoCompiler™: Component engineers can now use the Layout Geometry Wizard to import parametric cell layouts from OptoCompiler directly into Lumerical FDTD or MODE. The imported layout is then rebuilt in full 3D component for photonics or waveguide simulations. In Lumerical, engineers can modify the 3D component parameters, which are reported back into the associated OptoCompiler element.
Synopsys OptoCompiler™-INTERCONNECT Integration: Photonic Integrated Circuit designers can now use Lumerical INTERCONNECT directly from Synopsys OptoCompiler via PrimeWave and perform transient photonic circuit simulations with INTERCONNECT compact models and analyze results in WaveView, without leaving the OptoCompiler environment.
Photonic Verilog-A compact models for PrimeSim: CML Compiler can now generate photonic Verilog-A compact models compatible with PrimeSim HSPICE and PrimeSim SPICE circuit simulators. Using S‑parameters from Lumerical FDTD, MODE, and Multiphysics, users can design custom components and perform full electro‑optical co‑simulations within OptoCompiler.
Sentaurus TCAD - Lumerical FDTD Workflow: A new workflow with new featureshas been developed between Synopsys Sentaurus TCAD and Ansys Lumerical FDTD for CMOS Image Sensor design. Lumerical 2026 R1 supports new built-in script commands (tdrinfo, tdraddregion, and tdrwritedataset) that enable geometry import from TDR files into FDTD, MODE, and Multiphysics, as well as rectilineardataset export from the Lumerical script environment to a TDR file. The workflow enables the import of TDR geometry and materials into Lumerical FDTD, the optical simulation in FDTD, then the writing of the Optical Generation Rate results back into a new TDR file. These results can then be consumed by Sentaurus S-Device for electrical and thermal simulation with the illumination data. The workflow also benefits from GPU acceleration: Lumerical FDTD supports multi-node multi-GPU and Sentaurus S-Device supports GPU acceleration.
Shared Lumerical Enhancements
Lumerical connectors in optiSLang: A redesigned and improved Lumerical connector provides much better user experience, and new possibilities for advanced optimizations. New capabilities include:
Support for more input and output parameters from the model/structure groups and analysis groups
Automatically Lumerical version detection
GPU-enabled FDTD simulations
Automatic viewport image export without scripting
Support for relative or absolute paths for .lsf and .py post-processing scripts
Lumerical Sub-Wavelength Model (LSWM) plugin:
New input file format for LSWM plugin: The LSWM plugin used in Zemax OpticStudio and Speos to model diffraction gratings, polarizers and coatings now supports a new HDF5‑based .lswm input file format with improved compression, hierarchical structure and scalability for large datasets and future capabilities from 2026 R1. The LSWM plugin input file transitions from .json to .lswm.
Visualizer: A new "Save as Movie" export feature has been added to the Visualizer. You can use this functionality to generate movies from visualizations that are sliced with respect to one dimension or parameter of the data set, showcasing how plots change as a function of a specific parameter.
Ansys Product Improvement Program: Controls for the APIP participation have been moved to the Ansys license manager. Documentation explains how to opt in or out.
Ansys Automated Installer: You can now download Lumerical Dockerfiles for containerized workflows when installing using the Ansys Automated Installer.
Ansys Lumerical FDTD™
FDTD solver:
Direct Meshing to GPU: A new CPU meshing-to-GPU feature has been added to the FDTD solver. It greatly reduces host memory requirement and shortens overall runtime, particularly for 3D geometries with smooth curved surfaces. This improvement also utilizes modern cloud hardware, where GPU memory is growing faster than host memory on cloud instances. Benchmark on the metalens example using two NVIDIA H100 GPUs shows 90% reduction in memory usage, and about 50% reduction in total wall time.
Broadband sources: A new broadband source technique is now used as the default for FDTD CPU calculations to improve performance. No changes in simulation results are expected.
Automatic Memory/Thread Balancing: The RCWA solver now automatically reduces the number of threads when insufficient memory is available for one simulation per thread. Excess threads are repurposed for linear algebra acceleration.
New export UI and script command for LSWM: The ability to export files for the LSWM plugin is improved and supports the new format. More options, such as re-sampling and interpolation options have also been added to the export UI, and you can now export by directly right-clicking on sweeps. The built-in script command lswmexport has also been updated accordingly to support these new features.
3D CAD Modern Viewport
Modern Viewport as Default: The Modern Viewport is now the default option when you first open Lumerical FDTD. Various functionalities of this viewport have been enhanced to improve its user experience.
Simulation object visibility: New buttons have been added to the Modern Viewport to toggle the visibilities of geometries, simulation regions, sources, and monitors. This allows for easier visualization of complex device geometries and speeds up the design process prior to simulation. For more information on how to use this feature, please see the Modern Viewport Knowledge Base article.
Origin marker in CAD: This enhancement improves spatial awareness within the 3D environment by clearly marking the central reference point (0,0,0). You can use this feature to easily orient yourself relative to the origin, enhancing navigation in CAD design.
Import (n,k) Material Glyph: Imported spatial (n,k) data now has a new graphical representation in the 3D CAD Modern Viewport.
Import Binary Glyph:Imported binary spatial data now has a new graphical representation in the 3D CAD Modern Viewport.
Import Surface Glyph:Imported surface data now has a new graphical representation in the 3D CAD Modern Viewport.
VCSEL Design Tool : The VCSEL Design Tool is a new beta feature Integrated into Lumerical Multiphysics for the design of Vertical-Cavity Surface-Emitting Lasers. It requires an Enterprise license and activation. To get access to this feature, please contact us via the contact form, or via the Ansys Innovation Space.
Geometry import: The VCSEL design tool supports automated import of layer files from a .csv spreadsheet for the quick creation of geometries representing epitaxial stacks with a large number of layers, doping, and alloy grading.
Materials: The VCSEL design tool supports graded optical alloys, which can be defined through a scripting interface. The III-V semiconductor optical material tool is also now integrated into Lumerical Multiphysics and available when using the VCSEL Design Tool.
Coupled simulations: The VCSEL Design Tool simulates coupled optical, electrical, and thermal behaviors of VCSELs, accounting for gain, group velocity, photon lifetime, and spontaneous emission within laser cavities. This advanced tool, based on the latest optoelectronics Lumerical solver, is designed for researchers and engineers who require fully coupled multi-physics finite element simulations of VCSELs.
Standing wave visualization: The VCSEL Design Tool supports automated visualization of refractive index profile and standing waves within the VCSEL cavity. It helps confirm the alignment with quantum wells and oxide layers. This visualization can be done using an optical field monitor along the cylindrical axis, and cold cavity simulation.
Ansys Lumerical INTERCONNECT™
IBIS-AMI model: A new IBIS-AMI model for simulation of high-speed optical SerDes links is now available for INTERCONNECT as a beta feature. This model uses a machine learning approach to model the non-linear behavior of optical devices, allowing optical modules to be better modeled in standard SerDes analysis tools. You can simulate the desired PIC in INTERCONNECT, and extract simulation data to create the IBIS-AMI models. System designers can then run Electro-Optic-Electrical link simulations using this model in standard SerDes design tools to evaluate signal integrity. For usage of the IBIS-AMI model, please contact us via the contact form, or via the Ansys Innovation Space.
Variant Ports for Scripted Element: Each variant now port independently adopts the type of the port it connects to. Unconnected variant ports remain as Variant until connected.
Eye Diagram element: The eye diagram element now displays results such as the Bit Error Rate, peak-to-peak jitter, rms jitter, rise time, and fall time for per-level results for multi-level modulations.
Symbol Mapper/Demapper elements: A new bitrate mode option has been added to the symbol mapper and demapper elements. Through these options, you can select whether the bitrate is kept constant as modulation order increases, enabling flexibility in designing communication systems with different timing constraints.