Improvements to Ansys Cloud HPC services Integration
Lumerical users can now submit large simulations and parameter sweeps to Ansys Cloud directly from Lumerical tools. Users also have access to HPC cloud performance hardware, on-demand pricing, and completely secure workflows.
Interoperability with Ansys Speos and Ansys optiSLang
New surface model creation for Speos (BSDF and diffraction gratings) allows you to account for visual perception effects with Speos Human Vision (beta availability). Updates to support optiSLang workflows including advanced optimization with Lumerical STACK for display applications (beta availability).
Multiphysics Suite Enhancements
New RCWA solver (BETA)
The 2022 R1 release introduces a new RCWA solver for fast simulation of multi-layer stacks with periodicity and surface patterning. The beta version of the solver is script based and provides users with basic functionalities.
Virtuoso Layout Integration
Direct bridge to communicate layout data between Virtuoso and FDTD/MODE enabling direct parameter extraction and optimization of p-cells.
Process enabled design flow for active PIC components (BETA)
Layer builder now supports custom design flow for active PIC components using foundry process files. The new feature, available in 2022 R1 in a beta capacity, allows users to set up the electrical and/or thermal material properties of their active components along with the optical ones and sets up the doping profiles automatically and accurately.
SYSTEM Suite Enhancements
New integration between Ansys Lumerical INTERCONNECT and KLayout, enables a layout driven design and simulation workflow for photonic integrated circuits.
New delete command in CML Compiler
New ‘delete’ command allows CML Compiler users to easily delete elements with source data from their library.